In-Line Automatic Glue Filling Machine + Material Preparation Systems

This model is suitable for automatic production line glue filling or dispensing station applications

With a standard three-axis system, it can realize glue filling for multi-specification products

Simple operation interface, supports free upgrade service

Configurable: dual-liquid screw valve, A/B switch valve, piston valve to achieve precise filling Glue work

Product Characteristics

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1. Gantry-type three-axis operation module, realizing point-to-point, straight line, shaped, circular arc interpolation and other graphic trajectory filling.

2. Independent research and development software system, realize two-component glue instant proportioning, instant mixing, instant filling operation.

3. Material Preparation Systems can be equipped with gear pumps, screw pumps, piston pumps, diaphragm pumps Feeding Method according to the characteristics of the glue.

4. The barrel is made of SUS304 stainless steel, corrosion-resistant. Double material barrel design, sealed storage, not easy to deteriorate, capacity 10L, 20L, 45L, 60L optional.

5. Glue barrel is equipped with constant temperature heating, motor stirring, vacuum defoaming, liquid level sensor, pipeline pressure monitoring and other functions, with abnormal alarms and interface prompts.


Applicable glue: epoxy resin, polyurethane, organic silicone and other two-component glue

Application areas: servo motors, Hall coils, automotive door control microswitches, EV power modules, automotive electronics, precision sensors, ignition coils, new energy motors/lithium batteries, solar photovoltaic and other industries.

Specification

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Equipment Name In-Line Automatic Glue Filling Machine + Material Preparation Systems
Equipment Model APSL541+MFS4545
Valid Itinerary X=500*Y=400*Z=100mm
Mechanical Precision ±0.02mm
Proportional Accuracy ≤±3%
Gluing Precision ≤±3%
Gluing Speed 5-20g/s
Material Preparation Systems Agent A 45L+Agent B 45L
Power Supply AC380V、50Hz、3.5KW
Working Air Source 0.5-0.7MPa
Exterior Dimensions L1100*W1100*H1850mm+ L1350*W700*H1430mm
Equipment Weight Approx. 420Kg+220Kg
Industry Applications

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Semiconductor Thyristor Module
Using two-component heat-dissipating organic silica gel and automatic glue filling process

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Electronic Water Pump
It adopts a two-component potting silicone gel process to effectively protect the internal components of the instrument. It is waterproof, heat-dissipating, vibration-resistant, and prevents loosening and breakage.

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