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CN
Home
About Veady
Company Profile
Company Culture
Enterprise Qualification
Factory Scene
Products
ADS-Automatic Dispensing Machine
APS-Automatic Gluing Filling Machine
VPS-Vacuum Glue Filling Machine
MFS-Material Preparation Systems
NEV - Adhesive Series
Valves / Measurement module
Fluid application accessories
Curing Equipment Series
Solution
Automatic coating production line
Vacuum Filling Production Line
Automatic Glue Filling Production Line
Applications
Automotive Electronics
Power Battery
Electric motor control
3C industry
White Goods
Power semiconductor
Photovoltaic energy storage
Ship Aviation
Medical equipment
Service Support
After-sales Service
Download
News
Company News
Industry News
Contact Us
Contact Information
Recruitment
Power semiconductor
Automotive Electronics
Power Battery
Electric motor control
3C industry
White Goods
Power semiconductor
Photovoltaic energy storage
Ship Aviation
Medical equipment
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Power semiconductor
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Power semiconductor
Substrate coated with glue
Semiconductor Thyristor Module
Wafer spraying and uniform bonding
IGBT
Semiconductor Thyristor Module
Using two-component heat-dissipating organic silica gel and automatic glue filling process
201,202,203,204
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