Veady made a brilliant appearance at AMTS 2025 Shanghai International Automotive Manufacturing Technology and Equipment and Materials Exhibition
2025-07-14
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Veady made its debut at AMTS 2025, with three innovative products leading the way in high-precision bonding technology for automotive manufacturing.





Three core exhibits to solve the problem of automotive bonding technology


1. CIPG Automatic dispensing machine - high-precision sealing expert

  • ± 0.02mm ultra precision positioning: Equipped with a high-precision CCD visual positioning system, it ensures the perfect molding of sealing lines for key components such as automotive OBC (on-board charger), ECU (electronic control unit), EDU (electric drive control unit), etc.

  • Intelligent quality control: supports real-time glue type detection, full traceability of production data, and seamless integration with MES system to achieve closed-loop process management.


  • Three stage vacuum gluing technology: completely eliminate the hidden danger of bubbles during the gluing process of electronic control components, and improve product reliability.

  • Four nozzle synchronous glue injection: Production efficiency is increased by 200% compared to traditional equipment, meeting the needs of large-scale orders.

  • Vacuum circulation material preparation system: achieves 24-hour uninterrupted continuous production, significantly reducing downtime costs.


  • ± 2% ultra-high precision measurement: specially designed for thermal conductive structural adhesives, piston type measurement ensures proportional stability.

  • Ceramic piston components: high temperature resistance (up to 200 ℃), corrosion resistance, wear resistance, and extended lifespan by three times.

  • Modular feeding design: flexible and compatible with 300mL drum or 5-gallon drum, suitable for different production scales.



  • Under the trend of "new four modernizations" in automobiles, the accuracy and reliability of bonding processes directly affect the overall performance of the vehicle. The three devices exhibited this time are designed to address the pain points of precision sealing, vacuum glue defects, and high viscosity glue mixing in the industry. Combined with digital management functions, they provide customers with a full chain solution from hardware to data.